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This is the free Material Data Center Datasheet of Ultramid® Advanced T2340G6 - PA6T/66-GF30 FR(40) - BASF

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제품 설명서
Polyphthalamide, light colorable, with a high melting point, halogen-free flame-retardant, low water absorption, good mechanical and dielectrical properties at elevated temperatures, soldering bath resistant.

As stated in our Letter of Equivalence, products manufactured according to mass balance approach with allocated resources based on biomass (BMBCertTM) and/or pyrolysis oil (CCycledTM) feature the same properties as the corresponding product based on fossil resources. Colors available (e.g. Orange RAL 2003).

Markets & applications
Automotive: Automotive electrics & electronics (E&E), sensors, fuel cell, e-mobility
E&E: Connectors, SMT (surface mount technology) applications, energy distribution
Consumer goods: Home appliances, consumer electronics
Processing/Physical Characteristics건조/응축단위시험규격
ISO 데이터
용융 부피 - 흐름 속도, MVR 50 / * cm³/10min ISO 1133
온도 325 / * °C -
하중 5 / * kg -
성형 수축률, 평행 0.4 / * % ISO 294-4, 2577
성형 수축률, 수직 1.1 / * % ISO 294-4, 2577
기계적 특성건조/응축단위시험규격
ISO 데이터
인장탄성률 10500 / 10500 MPa ISO 527
파단시 강도 150 / 130 MPa ISO 527
파단시 신율 2.5 / 2.5 % ISO 527
챠피 충격 강도 , +23°C 60 / 55 kJ/m² ISO 179/1eU
챠피 충격 강도, -30°C 55 / 50 kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C 7 / 7 kJ/m² ISO 179/1eA
열적 특성건조/응축단위시험규격
ISO 데이터
녹는점, 10°C/min 310 / * °C ISO 11357-1/-3
하중하에서의 변형온도, 1.80 MPa 275 / * °C ISO 75-1/-2
선형 열팽창 계수, 평행 20 / * E-6/K ISO 11359-1/-2
선형 열팽창 계수, 수직 70 / * E-6/K ISO 11359-1/-2
1.5mm 평균두께에서의 난연성 V-0 / * class IEC 60695-11-10
테스트 두께 1.6 / * mm -
Yellow Card 유효한 예 / * - -
두께 H인 제품의 난연성 V-0 / * class IEC 60695-11-10
테스트 두께 0.4 / * mm -
Yellow Card 유효한 예 / * - -
두께가 h인 제품의 난연성 등급 5V 5VA / * class IEC 60695-11-20
테스트 두께 1.5 / * mm -
Yellow Card 유효한 예 / * - -
전기적 특성건조/응축단위시험규격
ISO 데이터
상대 유전뮬, 1MHz 3.8 / 3.9 - IEC 62631-2-1
소산 인자, 1MHz 120 / 220 E-4 IEC 62631-2-1
부피 저항 1E13 / 1E13 Ohm*m IEC 62631-3-1
표면 저항 * / 1E15 Ohm IEC 62631-3-2
전기 압력 37 / 36 kV/mm IEC 60243-1
CTI - / 600 - IEC 60112
기타 특성건조/응축단위시험규격
물에서의 흡수성 4.4 / * % ISO 62와 유사
조건에서의 흡습성 1.35 / * % ISO 62와 유사
밀도 1440 / - kg/m³ ISO 1183
물질의 비성질건조/응축단위시험규격
ISO 데이터
점도수 120 / * cm³/g ISO 307, 1157, 1628
Processing Recommendation Injection Molding단위시험규격
Pre-drying - Temperature 120 °C -
Pre-drying - Time 8 h -
Processing humidity ≤0.05 % -
용융수지온도 310 - 330 °C -
성형온도 140 - 160 °C -
도표
점도-변형률 , Ultramid® Advanced T2340G6, PA6T/66-GF30 FR(40), BASF
전단-변형률 , Ultramid® Advanced T2340G6, PA6T/66-GF30 FR(40), BASF
응력-신율 , Ultramid® Advanced T2340G6 (건조), PA6T/66-GF30 FR(40), BASF
응력-신율 , Ultramid® Advanced T2340G6 (응축), PA6T/66-GF30 FR(40), BASF
시컨트탄성율-신율 , Ultramid® Advanced T2340G6 (건조), PA6T/66-GF30 FR(40), BASF
시컨트탄성율-신율 , Ultramid® Advanced T2340G6 (응축), PA6T/66-GF30 FR(40), BASF
인장탄성율-온도 , Ultramid® Advanced T2340G6 (건조), PA6T/66-GF30 FR(40), BASF
인장탄성율-온도 , Ultramid® Advanced T2340G6 (응축), PA6T/66-GF30 FR(40), BASF
특징
생산 공정
사출 성형
특별 특성
난연성, Halogen-free
특성
Thermal Stability
내화학성에
General Chemical Resistance
응용
자동차의, 전기 및 전자
지역별 검색
기타 정보
사E성
PREPROCESSING
Pre/Post-processing, max. allowed water content: .05 %
Pre/Post-processing, Pre-drying, Temperature: 120 °C
Pre/Post-processing, Pre-drying, Time: 8 h

PROCESSING
injection molding, Melt temperature, range: 310 - 330 °C
injection molding, Melt temperature, recommended: 320 °C
injection molding, Mold temperature, range: 140 - 160 °C
injection molding, Mold temperature, recommended: 140 °C
injection molding, Dwell time, thermoplastics: 5 min
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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